主要特點:
陶瓷載盤采用高純超細氧化鋁粉體經高溫燒制而成,具有純度高、雜質少、硬度高、耐磨耐腐蝕等特點,并且產品精度高、熱膨脹系數小、精度保持性好,適用于半導體晶圓材料的超精密加工。
Main features
Ceramic Holder is made of high purity and ultra-fine alumina powder by high temperature firing. It has the characteristics of high purity, less impurities, high hardness,wear resistance and corrosion resistance. The products has high precision, small thermal expansion coefficient and good accuracy retention. It is suitable for ultra-precision processing of semiconductor wafer materials.
用途:
主要用于LED 襯底及半導體晶圓(藍寶石片、碳化硅片、硅片、鍺片、砷化鎵片、氮化鎵片等)及其材料晶圓及窗口片的減薄、硬拋及CMP 拋光制程。
Application
It is mainly used for thinning, hard polishing and CMP polishing of LED substrate and semiconductor wafers(sapphire wafer, silicon carbide wafer,silicon wafer, germanium wafer, gallium arsenide wafer, gallium nitride wafer, etc.).
規格型號:
我公司可按照客戶的定制化需求提供陶瓷載盤產品,直徑范圍:Φ5~800mm。陶瓷載盤厚度:1~200mm, 平面度:0.001~0.002mm,并且可以根據客戶的要求進行設計和制造各種非標陶瓷載盤。
Specification:
Our company can provide ceramic disc products according to customer's customized requirements, diameter range is Φ5~800mm. the thickness range is 1~200 mm, flatness range is 0.001~0.002 mm, and can be designed and manufactured according to customer requirements of various non-standard ceramic holder.
陶瓷載盤規格及精度
Model specification and the precision for ceramic holder
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