應用領域及適用范圍:
主要用于多晶硅的磨方、倒角、磨面,單晶硅的磨面、滾圓。
Application
Mainly used for flat grinding and chamfering of polycrystalline silicon; flat and cylindrical grinding monocrystalline silicon.
主要特點:
高速高效磨削、使用壽命長、材料去除效率高、加工工件表面損傷層低、光潔度高。
Characteristics:
High speed and high efficiency grinding,long life span, high efficiency on stock removal, less damage and good finish of workpiece surface.
產品規格Specification
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